News & Events

As semiconductor manufacturing advances to finer process nodes, wafer-level defect analysis, failure location, and micro-nano fabrication have become key to improving yield. CIQTEK introduces the 8-inch Wafer Dual-Beam Full-Size Processing Solution, combining high-resolution imaging and precise ion beam processing to achieve "observation-analysis-cutting" across the entire wafer, providing strong technical support for advanced semiconductor processes.   This solution features a 150mm long-stroke high-precision sample stage, enabling full-wafer, non-destructive observation and processing of 8-inch wafers. With an external optical navigation system and intelligent anti-collision algorithms, it ensures rapid and precise wafer positioning and safe operation. The system is equipped with a Schottky field emission electron gun, offering a resolution of 0.9 nm @ 15kV, and an ion beam resolution of 3 nm @ 30kV, capable of defect detection, cross-section slicing, and micro-structure fabrication at the nanoscale.   Core Advantages: 150mm Travel Stage: Combines long travel with high precision for an extensive observation range. Excellent compatibility with different-sized fixtures. Robust structure ensures wafer stability and quick, reliable loading. 8-inch Quick Exchange: Intelligent weight-bearing design with a sliding base for stability and durability. Full-size compatibility: Supports 2/4/6/8-inch wafers. Fast sample exchange: Vacuum pumping and sample loading within one minute. Software and Anti-Collision: Fully automatic intelligent navigation with accurate movement and positioning. Multi-axis coordinated motion for full-wafer observation. Smart anti-collision: Trajectory simulation and algorithmic spatial calculations to avoid risks. Multiple real-time monitoring: Real-time multi-angle monitoring of wafer position. External Optical Navigation: Ultra-stable structure design suppresses image shake. High-definition imaging with a precise field of view for full-wafer display. Professional anti-glare lighting reduces wafer surface reflection.   Wafer observation range   CIQTEK Dual-Beam Electron Microscope Solution combines outstanding hardware with intelligent software systems, enabling efficient defect detection and process optimization through one-click brightness and contrast adjustment, auto-focus, and multi-format image output, empowering users to complete the full chain of tasks from defect discovery to process optimization.

In life sciences, achieving high-precision and large-scale 3D structural and dynamic analysis of biological samples such as cells and tissues has become key to breaking through research bottlenecks. CIQTEK has introduced a multi-technology-route Volumetric Electron Microscopy (VEM) solution, integrating SS-SEM, SBF-SEM, and FIB-SEM. This provides an all-around, high-performance, and intelligent platform for biological 3D reconstruction, helping researchers uncover the micro-level mysteries of life.   Three Advanced Technical Routes 01. SS-SEM High-Speed ImagingBy combining external serial sectioning with the CIQTEK high-speed HEM6000-Bio SEM, this solution enables rapid imaging and automated acquisition of large-volume samples. Data acquisition efficiency is more than 5× higher than conventional SEM, supporting 24/7 unattended high-throughput operation.   02. SBF-SEM In-Situ SectioningBased on the CIQTEK ultra-high-resolution SEM5000X with an integrated microtome, this approach achieves in-situ sectioning and imaging cycles. It offers simple operation, high automation, and effectively avoids surface contamination.   03. FIB-SEM High-Precision AnalysisLeveraging focused ion beam–electron beam dual-beam systems, this route delivers nanoscale Z-axis resolution to analyze fine structures such as organelles and membranes. It enables in-situ 3D reconstruction without physical slicing.   Intelligent Integration & Broad Applications The CIQTEK VEM solution deeply integrates AI algorithms and a multilingual software platform, supporting a full workflow from data acquisition, image alignment, and segmentation to 3D visualization. Compatible with mainstream reconstruction software, it significantly lowers the learning curve.   Application cases span neuroscience, cell biology, and pathogenic microbiology, offering a powerful tool for advancing life science research.

Research on the microscopic behavior of materials is entering a new era of multi-scenario coupling and in-situ dynamic characterization. CIQTEK has launched an innovative In-situ Mechanical Testing Solution, designed with outstanding openness and compatibility. It enables seamless integration of CIQTEK’s full range of electron microscopes with mainstream in-situ testing devices, providing a flexible and efficient platform for coupled analysis in diverse research scenarios.   Breaking the limitations of closed systems, the solution integrates all critical elements required for in-situ EM adaptability, featuring: High beam current: >100 nA, ideal for fast EDS/EBSD analysis Large space: 360 × 310 × 288 mm (L × W × H) High load capacity: 5 kg (up to 10 kg with custom fixtures) Multi-view CCDs: ensuring system safety during in-situ operation Multiple interfaces: supporting customized flange accessories Pre-acceptance: full accessory debugging before delivery, ensuring complete functionality without on-site installation issues The solution can be configured across CIQTEK’s full range of electron microscopy products, including CIQTEK SEM3200, SEM5000X, DB550 dual-beam systems, and more. It also offers seamless compatibility with tensile stages, heating stages, nanoindenters, and electrochemical workstations from world-leading suppliers. This open architecture enables researchers to flexibly combine the most suitable equipment, maximizing experimental performance.   CIQTEK’s in-situ stage solution supported customers in publishing a high-impact paper (DOI: 10.1126/science.adq6807).   CIQTEK’s In-situ Mechanical Solution also supports multi-field coupling (mechanical, thermal, electrochemical), enabling nanoscale real-time observation of materials under complex environments. By synchronizing high-resolution imaging with in-situ signals, researchers can capture critical phenomena such as crack propagation, phase transitions, and interfacial reactions with precision. With a temperature range of -170 to 1200 °C, advanced load control, and rapid response systems, it accurately simulates service conditions of materials across various industries. Combined with EBSD and EDS, it provides comprehensive datasets for understanding material behavior under coupled stimuli.   Successfully applied in aerospace materials, new energy devices, and biomedical materials, this solution demonstrates CIQTEK’s exceptional compatibility and scalability in advanced electron microscopy platforms.

Four-dimensional scanning transmission electron microscopy (4D-STEM) is one of the most cutting-edge directions in electron microscopy. By performing a two-dimensional scan across the sample surface while recording a full diffraction pattern at each scan point with a pixelated detector, 4D-STEM generates a four-dimensional dataset containing both real-space and reciprocal-space information. This technique breaks through the limitations of conventional electron microscopy that typically collects only a single scattering signal. Instead, it captures and analyzes the entire spectrum of electron–sample interactions. With 4D-STEM, researchers can achieve multiple advanced functionalities within a single experiment, including virtual imaging, crystal orientation and strain mapping, electric and magnetic field distribution analysis (differential phase contrast), and even atomic-resolution reconstruction through diffraction stacking. It greatly expands the dimensionality and depth of materials characterization, offering an unprecedented tool for nanoscience and materials research.   At the Chinese National Conference on Electron Microscopy 2025 (Sept 26–30, Wuhan), CIQTEK releases its 4D-STEM solution, designed to break through the boundaries of traditional imaging and deliver data with unmatched dimensionality and analytical power.   System Workflow   The CIQTEK 4D-STEM solution features high spatial resolution, multi-dimensional analysis, low-dose operation to minimize beam damage, and flexible data processing, providing researchers with reliable and outstanding methods for advanced materials analysis.

In the fields of high-temperature material performance research and phase transition mechanism analysis, traditional external heating methods often fail to combine precise micro-region temperature control with real-time observation.   CIQTEK, in collaboration with the Micro-Nano Center of the University of Science and Technology of China, has developed an innovative in-situ heating chip solution. By integrating MEMS heating chips with dual-beam electron microscopes, this solution enables precise temperature control (from room temperature to 1100°C) and micro-dynamic analysis of samples, offering a new tool for studying material behavior in high-temperature environments. This solution uses the CIQTEK dual-beam SEM and specialized MEMS heating chips, with temperature control accuracy better than 0.1°C and temperature resolution better than 0.1°C. The system also features excellent temperature uniformity and low infrared radiation, ensuring stable analysis at high temperatures. The system supports various characterization techniques during heating, including micro-region morphology observation, EBSD crystal orientation analysis, and EDS composition analysis. This allows for a comprehensive understanding of phase transitions, stress evolution, and composition migration under thermal effects.   The system operates without breaking the vacuum, fulfilling the full process requirements for sample preparation and characterization (in-situ micro-region EBSD).   The integrated workflow design covers the entire process, from sample preparation (ion beam processing, nano-manipulator extraction) to in-situ welding and heating tests. The system supports multi-angle operation, featuring a 45° heating chip and a 36° copper grid position, which meet the complex experimental needs. The system has been successfully applied in high-temperature performance research of alloys, ceramics, and semiconductors, helping users gain deeper insights into material responses in real-world environments.     September 26–30, Wuhan | 2025 Chinese National Conference on Electron MicroscopyCIQTEK's eight major electron microscopy solutions will be showcased!

CIQTEK has introduced its next-generation 12-inch wafer scanning electron microscope (SEM) solution, designed to meet the demands of advanced semiconductor manufacturing processes. Offering full-wafer inspection without the need for rotation or tilting, this innovative solution ensures high-resolution, non-destructive analysis to support critical process development. Equipped with an ultra-large travel stage (X/Y ≥ 300 mm), the system provides complete coverage of 12-inch wafers, eliminating the need for sample cutting or transfer. This ensures true "original size, original position" observation. With a Schottky field emission electron gun, it achieves a resolution of 1.0 nm at 15 kV and 1.5 nm at 1 kV, minimizing electron beam damage, making it ideal for sensitive materials and structures.     Key features include: Ultra-large travel stage (X/Y > 300 mm) for full-wafer inspection High-resolution imaging: 1.0 nm at 15 kV and 1.5 nm at 1 kV Automated loading and optical navigation system for fast wafer exchange and precise positioning Intelligent software for auto-focus, astigmatism correction, and multi-format image output   CIQTEK's 12-inch wafer inspection SEM is more than just an observation tool; it's a critical instrument driving higher yields and smaller nodes in semiconductor manufacturing.   September 26–30, WuhanCIQTEK will unveil eight cutting-edge electron microscopy solutions at the 2025 Chinese National Conference on Electron Microscopy!

In the fields of life sciences, biomedicine, food inspection, and soft matter research, achieving high-resolution imaging of hydrated and beam-sensitive samples has always been a major challenge. Conventional sample preparation methods, such as chemical fixation, dehydration, and drying, often result in shrinkage, deformation, or structural damage, leading to results that deviate from the true state of the sample.   Leveraging its advanced scanning electron microscopy technology, CIQTEK has introduced the Cryo-SEM Solution, which integrates low-temperature freezing and vacuum transfer. This enables in-situ, non-destructive, and high-fidelity microscopic observation of biological and sensitive samples, truly “freezing” the microscopic details of life.   With liquid-nitrogen slush rapid-freezing technology, samples can be vitrified instantly at -210 °C, preserving their original morphology and chemical composition to the greatest extent. The integrated cryo-preparation system combines freeze-fracture, sublimation coating, and low-temperature transfer, avoiding the complexity and potential errors of conventional manual preparation. Throughout the entire process, samples are maintained under cryogenic vacuum conditions and transferred to the SEM cryo-stage, where high-resolution imaging at -180 °C effectively suppresses electron beam damage and significantly improves image quality.   Cryo-prepared boxwood leaf showing intact vein structures, while the untreated sample exhibits severe shrinkage.   Yogurt   Mold Cryo-prepared yogurt sample clearly reveals protein networks and fungal hyphae.   In addition, the system offers strong compatibility, adaptable across CIQTEK's full range of SEMs and dual-beam FIBSEM systems, meeting diverse needs from routine observation to advanced analysis.   The CIQTEK Cryo-SEM Solution is more than just a set of instruments. It embodies a scientific approach dedicated to faithfully restoring the microscopic world. It empowers researchers to overcome technical limitations, capture critical details at the micro scale of life, and drive both fundamental research and applied development to new heights.   September 26–30, Wuhan At the 2025 Chinese National Electron Microscopy Academic Conference, CIQTEK will unveil eight cutting-edge EM solutions. Stay tuned!

CIQTEK is pleased to announce the successful installation and training of the FIBSEM DB550 at our Korean distributor GSEM’s Electron Microscope Center. This milestone marks an important step in expanding access to advanced focused ion beam scanning electron microscope (FIBSEM) technology in South Korea.     The DB550 combines high-resolution imaging with precise ion beam milling, enabling researchers to perform 3D reconstruction, cross-sectional analysis, and nanoscale material modification with efficiency and accuracy. With these capabilities, the system opens new possibilities for semiconductor analysis, materials science, and life science research. Following installation, CIQTEK engineers provided hands-on training to the GSEM team, covering both standard workflows and advanced applications. The interactive sessions ensured that users gained practical experience in operating the instrument, from sample preparation to high-resolution imaging and data analysis. The enthusiasm and engagement of the GSEM team highlighted the strong potential for the DB550 to support diverse research projects at the center.     This collaboration reflects CIQTEK’s commitment to working closely with partners worldwide. By equipping GSEM’s facility with the DB550, we are not only strengthening our presence in the Korean market but also helping local researchers gain access to cutting-edge tools for scientific innovation. We look forward to seeing the exciting results that GSEM’s Electron Microscope Center will achieve with the DB550, and we remain committed to providing ongoing technical support and collaboration.