High Speed SEM | HEM6000

High-speed scanning electron microscope for cross-scale imaging of large-volume specimens

CIQTEK HEM6000 facilities technologies such as the high-brightness large-beam current electron gun, high-speed electron beam deflection system, high-voltage sample stage deceleration, dynamic optical axis, and immersion electromagnetic & electrostatic combo objective lens to achieve high-speed image acquisition whilst ensuring nano-scale resolution.

The automated operation process is designed for applications such as a more efficient and smarter large-area high-resolution imaging workflow. The imaging speed can reach more than 5 times faster than a conventional field emission scanning electron microscope (fesem).

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Image Acquisition Speed
10 ns/pixel
2*100 M pixel/s
Resolution
1.3 nm@3 kV, SE; 1.5 nm@1 kV, SE
0.9 nm@ 30 kV, STEM
Acceleration Voltage
0.1 kV~6 kV (Deceleration Mode)
6 kV~30 kV (Non-deceleration Mode)

Field of View
Maximum 1*1 mm²
high-resolution minimum distortion 64*64 um²
Stage Repeatability

X ±0.6 um
Y ±0.3 um

High-Speed
Scanning Driver

Dwell time 10 ns/pixel, maximum imaging acquisition speed 2*100M pixel/s
Signal Electron Filtering
System
SE/BSE signal-free switching, mixing with adjustable ratio
Fully Electrostatic
High-Speed Beam Deflection System
High-resolution large field imaging achievable Maximum. Field of view up to 32um*32 um at 4 nm per-pixel

Sample Stage
Deceleration Technology
Reduce incident electron landing voltage, increasing signal electron capturing efficiency
Electromagnetic & Electrostatic Combo Immersion Objective Lens Beam Deflection System
Objective lens magnetic field immerses sample, contributes low-aberration high-resolution imaging

Semiconductor
Biology
Materials
Geology

Electro-Optical Systems	Resolution		1.3 nm@3 kV, SE; 2.2 nm@1 kV, SE
			1.9 nm @ 3 kV, BSE; 3.3 nm@1 kV, BSE
	Magnification		66 - 1,000,000x
	Acceleration Voltage		0.1 kV - 6 kV (Deceleration mode)
			6 kV - 30 kV (None-decel mode)
	Electron Gun		High brightness Schottky field emission electron gun
	Type of Objective Lens		Immersion electromagnetic & electrostatic combo objective lens
Sample Loading System	Vacuum System		Fully automatic oil-free vacuum system
	Specimen Monitoring		Horizontal main chamber monitoring camera; vertical sample exchange load-lock chamber monitoring camera
	Maximum Sample Size		4 inches in diameter
	Specimen stage	Type	Motorized 3-axis specimen stage (*optional piezoelectric driven specimen stage)
		Travel Range	X, Y: 110 mm; Z: 28 mm
		Repeatability	X: ±0.6 μm; Y: ±0.3 μm
	Specimen Exchange		Full automatic
	Sample Exchanging Duration		＜15 min
	Load-lock Chamber Cleaning		Fully automatic plasma cleaning system
Image Acquisition and Processing	Dwell Time		10 ns/pixel
	Acquisition Speed		2*100 M pixel/s
	Image Size		8K*8K
Detector & Accessories	Standard Configuration		In-lens electron detector
	Optional Configuration		Low-angle backscattered electron detector
			In-column high-angle backscattered electron detector
			Piezoelectric-driven specimen stage
			High-resolution large FOV mode (SW)
			Loadlock chamber plasma cleaning system
			6-inch specimen loading system
			Active anti-vibration platform
			AI noise reduction; large area field stitching; 3D reconstruction
User Interface	Language		English
	OS		Windows
	Navigation		Optical navigation, gesture quick navigation
	Automatic function		Auto sample recognition, auto imaging area selection, auto brightness & contrast, auto focus, auto stigmator

High-speed Automation
Fully automatic sample loading & offloading process and image acquisition operation, which makes the overall imaging speed 5 times faster than that of conventional FESEM
Large Field of View
Technology that dynamically shifts the optical axis according to the scanning deflection range, achieves minimum edge distortion
Low Imaging Distortion
Specimen stage tandem deceleration technology, achieves low landing energy, whilst obtaining high-resolution images

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