CIQTEK at Microscience Microscopy Congress 2025 in Manchester, Booth #131

Ultra-High Resolution Field Emission Scanning Electron Microscopy (FESEM)   The CIQTEK SEM5000X is an ultra-high resolution FESEM with optimized electron optics column design, reducing overall aberrations by 30%, achieving ultra-high resolution of 0.6 nm@15 kV and 1.0 nm@1 kV. Its high resolution and stability make it advantageous in advanced nano-structural materials research, as well as the development and manufacturing of high-technology node semiconductor IC chips.

High-speed Fully Automated Field Emission Scanning Electron Microscope Workstation   CIQTEK HEM6000 facilities technologies such as the high-brightness large-beam current electron gun, high-speed electron beam deflection system, high-voltage sample stage deceleration, dynamic optical axis, and immersion electromagnetic & electrostatic combo objective lens to achieve high-speed image acquisition whilst ensuring nano-scale resolution. The automated operation process is designed for applications such as a more efficient and smarter large-area high-resolution imaging workflow. Its imaging speed is over five times faster than that of a conventional field emission scanning electron microscope (FESEM).

Ultra High-Resolution Tungsten Filament Scanning Electron Microscope   The CIQTEK SEM3300 Scanning Electron Microscope (SEM) incorporates technologies such as "Super-Tunnel" electron optics, inlens electron detectors, and electrostatic & electromagnetic compound objective lens. By applying these technologies to the tungsten filament microscope, the long-standing resolution limit of such SEM is surpassed, enabling the tungsten filament SEM to perform low-voltage analysis tasks previously only achievable with field emission SEMs.

120kV Field Emission Transmission Electron Microscope (TEM)   1. Divided Workspaces: Users operate TEM in a divided room with comfort reducing environmental interference to TEM. 2. High Operational Efficiency: Designated software integrates highly automated processes, allowing efficient TEM interaction with real-time monitoring. 3. Upgraded Operational Experience: Equipped with a field emission electron gun with a highly automated system.  4. High Expandability: There are sufficient interfaces reserved for users to upgrade to a higher configuration, which meets diverse application requirements.