CIQTEK to Exhibit at Microscopy & Microanalysis 2025 in the USA
CIQTEK to Exhibit at Microscopy & Microanalysis 2025 in the USA
July 09, 2025
CIQTEK is excited to announce our upcoming participation in Microscopy & Microanalysis (MM) 2025, taking place July 27–31 at the Salt Palace Convention Center in Salt Lake City, Utah, USA. This annual conference is one of the most important global events in the field of microscopy, bringing together leading researchers, instrument developers, and application specialists.
CIQTEK Booth #1303
At our booth, visitors will have the opportunity to explore CIQTEK’s latest developments in electron microscopy, including our next-generation SEM and FIB systems. Whether you’re seeking high-resolution imaging, intuitive operation, or reliable performance, our solutions are designed to meet the needs of both research and industrial users.
Tuesday, July 29 & Wednesday, July 30, 5:45 – 6:45 PM
Tutorial Title: Unlocking the Power of High-Speed Scanning Electron Microscopy with No Compromise of Superb Imaging Resolution at Low kV
What to Expect: Discover the principles and performance of high-speed field emission SEM technology and how it is reshaping the landscape of across-scale, large-volume imaging. Learn what sets CIQTEK’s high-speed FESEM apart and how our bundled multi-tech solution boosts throughput, without sacrificing high-resolution performance at low accelerating voltages.
If you're working in materials science, life science, or any field that demands speed, scale, and precision, this is a session you won’t want to miss!
JH Technologies Booth #1403
Our trusted U.S. partner, JH Technologies, will also be exhibiting at Booth #1403, offering localized consultation, technical support, and insight into how CIQTEK products are serving laboratories across North America.
We look forward to meeting scientific professionals, collaborators, and microscopy enthusiasts in Salt Lake City to share insights, explore possibilities, and build lasting partnerships.
Save the date and visit us at M&M2025!
Follow CIQTEK on LinkedIn for more updates and behind-the-scenes highlights from MM2025.
120kV Field Emission Transmission Electron Microscope (TEM) 1. Divided Workspaces: Users operate TEM in a divided room with comfort reducing environmental interference to TEM. 2. High Operational Efficiency: Designated software integrates highly automated processes, allowing efficient TEM interaction with real-time monitoring. 3. Upgraded Operational Experience: Equipped with a field emission electron gun with a highly automated system. 4. High Expandability: There are sufficient interfaces reserved for users to upgrade to a higher configuration, which meets diverse application requirements.
High-speed Fully Automated Field Emission Scanning Electron Microscope Workstation CIQTEK HEM6000 facilities technologies such as the high-brightness large-beam current electron gun, high-speed electron beam deflection system, high-voltage sample stage deceleration, dynamic optical axis, and immersion electromagnetic & electrostatic combo objective lens to achieve high-speed image acquisition whilst ensuring nano-scale resolution. The automated operation process is designed for applications such as a more efficient and smarter large-area high-resolution imaging workflow. Its imaging speed is over five times faster than that of a conventional field emission scanning electron microscope (FESEM).
Ultra High-Resolution Tungsten Filament Scanning Electron Microscope The CIQTEK SEM3300 Scanning Electron Microscope (SEM) incorporates technologies such as "Super-Tunnel" electron optics, inlens electron detectors, and electrostatic & electromagnetic compound objective lens. By applying these technologies to the tungsten filament microscope, the long-standing resolution limit of such SEM is surpassed, enabling the tungsten filament SEM to perform low-voltage analysis tasks previously only achievable with field emission SEMs.
Ultra-High Resolution Field Emission Scanning Electron Microscopy (FESEM) The CIQTEK SEM5000X is an ultra-high resolution FESEM with optimized electron optics column design, reducing overall aberrations by 30%, achieving ultra-high resolution of 0.6 nm@15 kV and 1.0 nm@1 kV. Its high resolution and stability make it advantageous in advanced nano-structural materials research, as well as the development and manufacturing of high-technology node semiconductor IC chips.