CIQTEK and SciMed Wrap Up a Successful Presence at MMC 2025
CIQTEK and SciMed Wrap Up a Successful Presence at MMC 2025
July 07, 2025
CIQTEK is pleased to announce the successful completion of our participation in the Microscience Microscopy Congress (MMC) 2025, held from July 1 to 3 at Manchester, UK. As one of the largest and most influential events dedicated to microscopy in Europe, MMC brought together leading researchers, instrument manufacturers, and innovators from around the world.
About MMC:
The Microscience Microscopy Congress is one of Europe’s leading microscopy conferences, organized by the Royal Microscopical Society. It features a vibrant exhibition, international conference sessions, and practical workshops, attracting thousands of professionals in imaging and analysis.
This year, CIQTEK joined hands with our valued UK partner, SciMed Ltd., to exhibit at a shared booth, presenting our Tungsten Filament Scanning Electron Microscope SEM3200, a cost-effective, high-performance solution for routine imaging and materials analysis.
Throughout the three-day event, we were delighted to engage with researchers, engineers, and microscopy enthusiasts from across academia and industry. Visitors had the opportunity to see live demonstrations, discuss application needs, and explore how CIQTEK’s SEM technology can support their work with reliable imaging performance, user-friendly operation, and accessible pricing.
In addition to our joint booth with SciMed, we are proud to have another CIQTEK SEM3200 Tungsten Filament SEM featured at the Bruker booth. We sincerely thank Bruker for their collaboration and for providing this platform to showcase our technology to a wider audience, enabling visitors to see firsthand the powerful integration of CIQTEK’s SEM with Bruker’s advanced analytical solutions.
We extend our heartfelt thanks to everyone who visited our booth and shared valuable feedback. A special thank-you to SciMed for their strong support and seamless collaboration before and during the event. We look forward to deepening our partnership and continuing to serve the UK microscopy community together.
120kV Field Emission Transmission Electron Microscope (TEM) 1. Divided Workspaces: Users operate TEM in a divided room with comfort reducing environmental interference to TEM. 2. High Operational Efficiency: Designated software integrates highly automated processes, allowing efficient TEM interaction with real-time monitoring. 3. Upgraded Operational Experience: Equipped with a field emission electron gun with a highly automated system. 4. High Expandability: There are sufficient interfaces reserved for users to upgrade to a higher configuration, which meets diverse application requirements.
High-speed Fully Automated Field Emission Scanning Electron Microscope Workstation CIQTEK HEM6000 facilities technologies such as the high-brightness large-beam current electron gun, high-speed electron beam deflection system, high-voltage sample stage deceleration, dynamic optical axis, and immersion electromagnetic & electrostatic combo objective lens to achieve high-speed image acquisition whilst ensuring nano-scale resolution. The automated operation process is designed for applications such as a more efficient and smarter large-area high-resolution imaging workflow. Its imaging speed is over five times faster than that of a conventional field emission scanning electron microscope (FESEM).
Ultra High-Resolution Tungsten Filament Scanning Electron Microscope The CIQTEK SEM3300 Scanning Electron Microscope (SEM) incorporates technologies such as "Super-Tunnel" electron optics, inlens electron detectors, and electrostatic & electromagnetic compound objective lens. By applying these technologies to the tungsten filament microscope, the long-standing resolution limit of such SEM is surpassed, enabling the tungsten filament SEM to perform low-voltage analysis tasks previously only achievable with field emission SEMs.
Ultra-High Resolution Field Emission Scanning Electron Microscopy (FESEM) The CIQTEK SEM5000X is an ultra-high resolution FESEM with optimized electron optics column design, reducing overall aberrations by 30%, achieving ultra-high resolution of 0.6 nm@15 kV and 1.0 nm@1 kV. Its high resolution and stability make it advantageous in advanced nano-structural materials research, as well as the development and manufacturing of high-technology node semiconductor IC chips.